5 segments · 33 companies · as of Sep 18, 2026
Foundry
Factories that turn AI chip designs into logic, optical and power wafers
Where it sits
Feeds: Compute Silicon · Memory & Storage · Networking & Interconnect
Foundries manufacture chips designed by other companies. AI needs leading-edge logic for accelerators and CPUs, but also specialty processes for optical links, power management and interposers. Yield, design libraries, capacity and trusted geographic supply determine customer choices.
Why now
N2 and 18A production ramps make 2026 a transition year for logic. Optical interconnect demand drives new SiPho and SiGe capacity, while national fab projects and Chinese specialty expansions reshape regional supply.
Leading-edge Logic & R&D
Manufacturers and research fabs developing dense logic for AI processors. TSMC, Samsung and Intel offer production processes; SMIC supplies China's most advanced logic. Rapidus is a 2nm pilot entrant, while IBM contributes research fabrication and technology transfer rather than merchant volume.
Makes Nvidia Blackwell on 4NP and ramps N2 nanosheets alongside N3-family wafers for advanced compute
leaderRamps SF2-family GAA foundry processes; makes 4nm HBM base dies and develops 2nm HPC customer designs
challengerProduces 18A with RibbonFET and PowerVia; 18A-P is in risk production and 14A remains in customer development
challengerFabricates Huawei Kirin N+2/N+3 7nm-class logic with DUV multi-patterning; remains behind global 2nm processes
challengerDemonstrates 2nm GAA transistors on its pilot line using IBM technology; targets commercial production in 2027
emergingFabricates Albany research nanosheets and backside-power test structures; transfers 2nm process technology to Rapidus
niche
Sources: trendforce.com, news.samsung.com, intel.com, techinsights.com, rapidus.inc, newsroom.ibm.com
Photonics, SiGe & RF foundry
Optical and high-frequency wafers move data into and between AI processors. Transceiver makers buy SiPho, SiGe and compound semiconductor platforms; foundry process libraries and optical yield shape adoption.
Makes SiPho and SiGe wafers for optical transceivers; expands 300mm photonics capacity in Japan
leaderOffers Fotonix and SiGe platforms; acquired AMF adds Singapore silicon photonics foundry capacity
leaderProduces PIC100 photonics on 300mm wafers in Crolles for 800G/1.6T optics, including AWS collaboration
majorProvides GaAs RF and optical laser/photodiode foundry processing, including epitaxy and wafer test
majorOffers XPH90 silicon photonics and industrial-scale SiN processing in collaboration with LIGENTEC
nicheSupplies low-loss SiN photonics platforms and customer access to X-FAB's XPH90 silicon photonics
nicheFabricates customer-designed InP photonic circuits on 4-inch wafers with epitaxial regrowth
nicheOffers InP DHBT processes for optical TIAs/laser drivers and GaAs HBT/pHEMT foundry services
nicheFabricates 6-inch GaAs HBT, pHEMT and BiHEMT wafers for RF front ends and communications ICs
nicheOffers custom GaAs and GaN MMIC wafer runs with RF process design kits and on-wafer testing
nicheProduces 300mm silicon-photonics wafers for Silith's optical interconnect platform at its Singapore fab
challengerVia SilTerra, offers 200mm silicon-photonics foundry processing for optical transceivers and sensing PICs
niche
Sources: towersemi.com, investors.gf.com, st.com, nasdaq.com, gcsincorp.com, awsc.com.tw
Mature-node, power & analog foundry
Established silicon processes manufacture control, power and interface chips surrounding AI compute. Customers choose qualified analog devices, specialty voltage options, dependable capacity and competitive wafer costs.
Makes 22/28nm and mature-node logic wafers for communications, control and mixed-signal devices
leaderOffers 55BCD and 130BCD foundry processes for analog, digital and power-management IC integration
majorRuns 200mm BCD, high-voltage and power-management foundry lines for analog IC designers
majorFabricates mature-node logic and memory wafers at its retained Taiwan fabs after selling Tongluo to Micron
majorProvides TS18PM 180nm BCD and TS18SOI process platforms for power-management ICs
majorSupplies 200mm BCD, analog and power-device foundry processes; develops SiC and GaN platforms
majorFabricates analog and power ICs on the XT018 180nm BCD-on-SOI platform
majorVia SK keyfoundry, manufactures 200mm analog and mixed-signal ICs and develops 650V GaN processes
nicheVia SkyWater's Bloomington and Austin Fab 25 foundries, sells specialty wafer fabrication and process development
nicheOperates an independent US 200mm foundry for analog and power semiconductor customers
nicheVia SilTerra, manufactures 200mm specialty CMOS and MEMS wafers for mixed-signal and sensor customers
niche
Sources: trendforce.com, ionq.com, skywatertechnology.com, powerchip.com, insage.com.my, sec.gov
China domestic foundry
Domestic foundries supply Chinese logic, image-sensor, analog and power designs. Advanced-node access remains constrained, while differentiated mature processes and local production underpin new fab investment.
Runs China's largest merchant foundry, spanning 200mm analog and 300mm logic production
leaderFabricates embedded-memory, analog and power wafers; incorporates acquired Huali foundry operations
majorExpands 300mm foundry capacity for display drivers, image sensors and diversified logic processes
challengerOffers 0.18um DB BCD G2S foundry processes for motor drivers and power-management ICs
majorProvides 0.18um and 0.35um BCD foundry processes with SOI and BCD+eflash options for power ICs
challengerBuilds 55nm-to-28nm specialty capacity at its Beidian Integrated 300mm foundry project
challengerOffers specialty 300mm foundry and S-stacking/M-stacking wafer-level 3D integration processes
nicheRuns 0.15um EPI BCD, 0.18um BCD and 0.35um 700V BCD foundry processes for power-management ICs
challengerOperates Guangzhou 300mm analog and mixed-signal foundry lines; its announced IPO is not yet a traded listing
challenger
Sources: trendforce.com, hkexnews.hk, gtasemi.com.cn, finance.sina.com.cn, xmcwh.com
New fabs & regional capacity
New entrants and regional projects diversify where wafers are made. Government support helps fund expensive facilities, but process transfer, customer qualification and sustained utilization determine commercial success.
Expands Arizona logic manufacturing and regional foundry capacity through JASM and ESMC ventures
leaderBuilds Chitose IIM-1 around a 2nm pilot line; commercial manufacturing remains targeted for 2027
emergingBuilds the Dholera 300mm foundry using PSMC technology for planned 28nm-to-110nm processes
emergingBuilds the VSMC Singapore 300mm foundry with NXP, targeting initial production in 2027
challengerRepurposes Arai and expands Uozu for 300mm SiPho/SiGe; first new capacity targets late 2027
majorExpands US independent analog and power wafer capacity with private and public funding
nicheReportedly begins 2nm AI5 trial wafers at Taylor; Tesla supply ramps remain prospective
challengerRamps Arizona Fab 52 for 18A and develops an Ocotillo 12nm foundry flow with UMC, targeting production in 2027
challengerPartners with Intel on US 12nm manufacturing at Ocotillo; joint process qualification precedes customer volume
emerging
Sources: reuters.com, rapidus.inc, taipeitimes.com, towersemi.com, en.sedaily.com, intel.com
Glossary
- GAA
- Gate-all-around transistors wrap the gate around nanosheets to control leakage at small process nodes.
- SiPho
- Silicon photonics integrates optical functions on wafers for high-bandwidth data links.
- SiGe
- Silicon germanium supports high-frequency analog circuits such as optical drivers and amplifiers.
- PDK
- A process design kit describes the devices and rules a chip designer uses for a specific foundry process.
- Interposer
- A routing layer that connects logic chiplets and memory within one package.
Heat, spend, exposure and shares are editorial estimates. How to read the map ↗