7 segments · 86 companies · as of Sep 18, 2026
Test & Burn-in
Electrical tests that screen AI chips, HBM and complete packages before shipment
Where it sits
Feeds: Compute Silicon · Memory & Storage · Networking & Interconnect
Testing separates usable dies from defective ones before expensive assembly, then checks complete AI packages under electrical and thermal stress. The chain includes testers, contacts, wafer probers, handlers, burn-in systems and independent test houses. Pin density, power delivery and throughput determine cost and yield.
Why now
HBM4 adds logic-rich base dies and more test contacts, while larger AI processors demand higher test power and longer reliability screening. Korean HBM tester orders and AI burn-in expansion are broadening the equipment and interface supply chain.
Automated test equipment
ATE measures the electrical performance of logic, memory, power and optical devices. Chipmakers and test houses choose platforms by channel count, signal integrity, power delivery, test software and throughput.
Supplies V93000 EXA Scale for AI SoCs and T5800-family testers for high-speed DRAM
leaderSupplies UltraFLEXplus logic ATE and Magnum 7H for HBM base-die and stacked-memory tests
leaderOffers 3680 SoC ATE and 3650-S2 analog systems alongside integrated RF and optical test platforms
majorVia Digital Frontier, supplies HBM4 wafer testers to SK hynix; also makes memory final-test systems
challengerSupplies HBM4 wafer testers to SK hynix alongside DRAM and NAND test equipment
challengerSupplies memory wafer testers and board upgrades to Samsung under disclosed 2026 equipment contracts
challengerSupplies Samsung with CLT chamber-level memory testers and enterprise SSD testers under 2026 orders
nicheTests enterprise SSDs, memory modules and CXL memory devices with automated electrical platforms
nicheSupplies D9000 digital SoC testers and analog/mixed-signal ATE for wafer sort and final electrical screening
challengerSells AccoTEST STS8300 analog/PMIC testers and liquid-cooled STS8600 SoC systems for FPGA and MCU testing
challengerSupplies Diamondx ATE for mixed-signal, power-management, RF and system-on-chip devices
majorVia NI, supplies STS modular semiconductor production test systems and characterization tools
nicheSupplies NX5402A silicon-photonics wafer test plus parametric and RF semiconductor characterization
nicheSupplies DOT800 multicore analog/mixed-signal testers for high-parallelism power, sensor and MEMS screening
niche
Sources: advantest.com, accotest.com, spea.com, hzcctech.com, en.edaily.co.kr, asiae.co.kr
Probe cards & precision contacts
Probe cards connect tiny wafer pads or bumps to electrical testers. Memory and logic manufacturers need many reliable contacts, fine pitch and high current; custom interfaces are qualified against each chip design.
Supplies fine-pitch MEMS probe cards and TPEG technology for complex logic wafer testing
leaderMakes SmartMatrix MEMS memory probe cards and advanced logic/RF contacts for AI wafer testing
leaderMakes U-Probe and MEMS probe cards for DRAM wafer testing, including HBM memory production
leaderSupplies MC memory and MT fine-pitch MEMS probe cards plus vertical contacts for logic wafers
majorSupplies vertical and cantilever probe cards for wafer-level electrical testing
majorIntegrates vertical probe cards, probe PCBs and substrates into turnkey wafer-test interfaces for logic devices
majorProduces probe cards for DRAM, NAND and SoC wafer testing with parallel die contact
majorSupplies memory and non-memory probe cards with in-house probe design and manufacturing
nicheMakes MEMS memory probe cards on 300mm ceramic substrates under PMT, formerly Microfriend
nicheVia Nidec Advance Technology's SV Probe, makes 2D-MEMS vertical cards with high-current and thermal probes
nicheVia Hansol WillTech, acquired in June 2026, makes MEMS vertical and socket probe cards for logic wafer test
nicheVia Soulbrain Memsys, manufactures MEMS probe cards; the probe-card business is distinct from SLD's display operations
nicheMakes ViProbe vertical cards and FeinProbe contacts for WLCSP, SiP and flip-chip wafer testing
nicheSupplies Chinese MEMS, vertical and cantilever probe cards for wafer electrical testing
challengerDevelops MEMS, vertical and cantilever probe cards for Chinese wafer-test customers
challengerMakes MEMS buckling and spring probe elements for fine-pitch, high-frequency chip test contacts
nicheMakes front-end probe cards using micro-precision spring contacts for wafer-level electrical screening
nicheBuilds 2D-MEMS logic and 3D-MEMS DRAM/NAND probe cards with proprietary probes and high-density test boards
challengerMakes custom cantilever probe cards in Sandy, continuing Wentworth's engineering wafer-test product line
niche
Sources: technoprobe.com, kind.krx.co.kr, mynewsdesk.com, zenfocuscorp.com, yokowo.co.jp, sandysemiconductortestsolutions.com
Wafer & bare-die probers
Probers position wafers or separated dies against test contacts while controlling temperature. Precision, parallelism and low damage rates matter as HBM stack contacts and photonic alignment become harder to handle.
Supplies Precio wafer probers with thermal and contact control for high-volume electrical testing
leaderSupplies Accretech wafer probing systems for memory, logic and advanced semiconductor devices
leaderMakes Cube Prober systems for HBM die-level testing with 256-site parallelism and dual chucks
challengerMakes automated and engineering probe stations for RF, power and photonic wafer characterization
majorSupplies engineering RF/SiPho probe stations and cryogenic wafer probing for low-temperature device characterization
majorSupplies OPUS3 production wafer probers and SLT variants with controlled-temperature probing
challengerSupplies CP12-SOC/CIS and CP12-Discrete automatic probers; memory probing remains a developing product line
challengerBuilds and services Wentworth-line wafer probe stations for engineering, high-voltage and temperature-controlled tests
niche
Sources: tel.com, formfactor.com, reportdocs.static.szse.cn, sandysemiconductortestsolutions.com, semics.com, mpi-corporation.com
Test sockets & interface boards
Sockets and interface boards connect packaged chips to testers. AI packages require dense contacts, clean high-speed signals and substantial current; wear, thermal design and fast customization drive repeat demand.
Combines HyperSocket test contacts with HEATCon Titan active thermal control for large AI packages
leaderMakes fine-pitch spring probes and high-pin-count sockets for AI logic and system-level tests
majorSupplies silicone-rubber and pogo-pin test sockets for high-speed logic and memory devices
majorVia AIS, combines former Essai sockets and R&D Altanova boards into integrated test interfaces
majorVia DIS, including former Harbor Electronics, supplies high-performance test PCBs and final-test interfaces
majorVia Smiths Interconnect, supplies spring-contact semiconductor test sockets and high-frequency interfaces
majorSupplies burn-in sockets and functional test contactors for memory and logic semiconductor packages
majorMakes semiconductor test sockets and related interfaces for electrical and reliability screening
majorVia KITA and its contactor portfolio, supplies spring probes and elastomer contacts for packaged-device test
majorManufactures test sockets and interface boards alongside its wafer probe-card business
majorSupplies memory burn-in and final-test sockets for packaged semiconductor devices
nicheMakes burn-in, module/SSD and packaged-device test sockets under the MCS brand
nicheIntegrates custom test sockets, load boards and handler change kits for semiconductor test cells
nicheVia Ironwood Electronics, supplies high-frequency BGA, LGA and QFN test sockets and device adapters
nicheMakes precision semiconductor test contactors with RF and high-reliability contact designs
nicheDevelops proprietary test contactors and sockets for integrated-circuit production testing
nicheSupplies probe-card substrates, load boards and burn-in boards for wafer and final test
nicheManufactures semiconductor load boards, probe-card PCBs, burn-in boards and test interposers
nicheBuilds high-density IC load boards and memory DUT boards that connect packaged devices to production ATE
majorSupplies fine-pitch spring probes and back-end sockets for high-frequency packaged-device tests
majorDesigns IC load boards and ceramic test-interface substrates connecting advanced processors to production testers
niche
Sources: smiths.com, kita-mfg.com, yokowo.co.jp, chpt.com, zenfocuscorp.com, winwayglobal.com
Burn-in, reliability & system-level test
Burn-in stresses chips to expose early failures, while system-level tests exercise realistic workloads. AI processor power and costly memory stacks increase the value of reliable screening before systems ship.
Supplies FOX-XP wafer-level AI burn-in and Sonoma high-power packaged-part systems from Incal
majorProvides system-level test platforms and memory burn-in solutions for complex semiconductor devices
leaderSupplies Titan system-level test platforms for computing devices beyond conventional ATE screening
majorSupplies production SLT and burn-in platforms with PiXL active thermal control; participates in Intel Foundry's ecosystem
majorSupplies 3200 system-level test automation and high-power thermal test solutions for AI devices
majorDevelops in-house high-power burn-in ovens and monitored stress tests for AI GPU, ASIC and CPU customers
majorSupplies memory burn-in testers to Samsung and integrates HBM wafer test through Digital Frontier
majorSupplies HBM4 wafer burn-in testers to SK hynix under disclosed 2026 contracts, screening many dies in parallel
majorSupplies memory burn-in and chamber-level reliability testers alongside its SSD electrical test platforms
nicheSupplies HPB-8 burn-in systems with active thermal control for AI processors above 2,000W per device
nicheSupplies burn-in and reliability equipment and provides outsourced semiconductor stress screening
nicheVia KES, provides burn-in systems and boards alongside outsourced burn-in and test services
nicheMakes semiconductor burn-in systems and environmental chambers for device reliability qualification
nicheProvides thermal streams, chucks and chambers for controlled-temperature semiconductor reliability tests
nicheSupplies wafer-level and packaged-device burn-in systems for processors, memory and power devices
nicheVia retained STAr Technologies, supplies PLUTO wafer/package reliability testers; probe-card operations were divested
niche
Sources: aem.com.sg, microcontrol.com, dealsite.co.kr, post.tokyoipo.com, exicon.co.kr
Handlers & thermal control
Handlers load chips, establish repeatable contact and sort test results. AI accelerators add thermal loads that require active cooling, strong contact force and careful handling of large, expensive packages.
Supplies FT/SLT handlers and ATC active thermal control, including liquid-cooled HT-3192 systems
leaderSupplies pick-and-place handlers with T-Core active thermal control for powered-device testing
majorSupplies memory and logic test handlers integrated with its electrical test and thermal platforms
majorIntegrates high-parallelism handling and PiXL active thermal control around high-power processor SLT cells
majorMakes memory and SoC test handlers that load, temperature-condition and sort packaged chips
majorCombines 3200 SLT handling with tri-temperature thermal systems for high-power chip testing
majorMakes C6800T tri-temperature handlers with ATC and C6100TS systems for final and system-level test
challengerSupplies Zeus gravity handlers and Panacea pick-and-place systems with thermal and MEMS options
nicheSupplies M500HT and MH-series memory handlers plus ML-series logic handlers for automated hot/cold package testing
nicheSupplies JTS-8500 burn-in sorters that load and unload memory packages around reliability screening
nicheSupplies 5170-IH film-frame handlers for WLCSP and panel-packaged devices undergoing electrical test
nicheBuilds Trooper optical-device test automation and ZETA wafer burn-in handling for lasers and photonic devices
nicheMakes turret, gravity and pick-and-place IC test handlers for back-end semiconductor production
nicheSupplies ThermoStream and related temperature-control tools for localized device testing
nicheVia NS Technologies, manufactures the former Epson IC handler line and supports installed test cells
niche
Sources: aem.com.sg, jtcorp.co.kr, mirae.com, tesec.co.jp, pentamaster.com.my, ns-technologies.co.jp
Outsourced test services
Independent test houses and OSATs provide wafer sort, packaged-device test and reliability screening. Customers buy qualified equipment capacity and engineering expertise; AI test time and thermal complexity drive investment.
Provides wafer sort, final test and in-house high-power burn-in for GPU, ASIC and CPU devices
leaderProvides wafer probing, package test and system-level screening across ASE and SPIL operations
leaderOffers wafer probe, final test and system-level test integrated with advanced package assembly
majorProvides wafer probing and final test for logic, RF and memory devices across its Taiwan test group
majorSupplies independent wafer, final and reliability testing for analog, power, logic and memory devices
majorProvides memory and logic testing alongside advanced packaging and assembly services
majorSupplies wafer probing and final-test services for memory, display-driver and mixed-signal ICs
majorProvides wafer and final electrical testing for application processors, image sensors and system chips
majorSupplies outsourced electrical testing connected to bumping and wafer-level packaging flows
nicheProvides wafer probing and package testing for display drivers, image sensors and system ICs
majorSupplies wafer sort, mixed-signal/RF test and reliability screening with package assembly services
majorProvides wafer probing and final electrical testing alongside outsourced semiconductor assembly
nicheProvides 200mm/300mm wafer test, final test and custom test development for fabless customers
challengerVia Integra Technologies, supplies US assembly, electrical test and reliability qualification services
nicheProvides wafer probe, final and system-level testing for high-performance digital, RF and mixed-signal devices
majorTests CPUs, GPUs and networking chips through TF-AMD operations, from wafer probing to system-level screening
majorOffers CP wafer sort, final test and SLT with memory, RF, digital and analog test platforms
majorVia Carsem, supplies mixed-signal, analog, RF and power-device test development, final test and reliability screening
major
Sources: kyec.com.tw, jcetglobal.com, tfme.com, en.ht-tech.com, carsem.com, prnewswire.com
Glossary
- ATE
- Automated test equipment applies electrical patterns and measures whether a chip meets its specifications.
- Probe card
- An array of precision contacts connects a wafer to a tester before chips are separated.
- KGD
- Known good die are screened before assembly to avoid wasting costly chiplet packages.
- Burn-in
- Electrical and thermal stress exposes early device failures before shipment.
- SLT
- System-level test exercises a chip in conditions resembling its final computing environment.
- ATC
- Active thermal control holds a powered device at a target temperature during testing.
Heat, spend, exposure and shares are editorial estimates. How to read the map ↗